W-band Dual Channel Mixer
CHM2378a
In the case of connection from MMIC to an external substrate a network is
proposed on soft substrate for LO, RF1 and RF2 ports. The following drawings
give the dimensions (in mm) for a DUROID substrate (thickness=0.127mm,
r=2.2).
0.42
0.15
= Bonding area
0.94
Proposed matching network for a 50
Ω
transition between LO and a µ-strip
line on DUROID substrate
0.2
0.73
= Bonding area
Proposed matching network for a 50
Ω
transition between RF1/RF2 and µ-
strip lines on DUROID substrate.
Ref. DSCHM2378a6354 - 20 Dec 06
7/8
Specifications subject to change without notice
Route Départementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
0.325
0.2
0.25
UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
