10-27GHz Detector
CHE1260-QAG
Definition of the Sij reference planes
The reference planes used for Sij
measurements given above are
symmetrical from the symmetrical axis
of the package (see drawing beside).
The input and output reference planes
are located at 2.65mm offset (input
wise and output wise respectively)
from this axis. Then, the given Sij
parameters
incorporate
the
recommended land pattern of the
evaluation motherboard .
Recommended package footprint
Refer to the application note AN0017 available at
http://www.ums-gaas.com
for
package foot print recommendations and exact package dimensions.
SMD mounting procedure
The SMD leadless package has been designed for high volume surface mount PCB
assembly process. The dimensions and footprint required for the PCB (motherboard)
are given in the drawings above.
For the mounting process standard techniques involving solder paste and a suitable
reflow process can be used. For further details, see application note AN0017.
Recommended environmental management
Refer to the application note AN0019 available at
http://www.ums-gaas.com
for
environmental data on UMS package products.
Recommended ESD management
Refer to the application note AN0020 available at
http://www.ums-gaas.com
for ESD
sensitivity and handling recommendations for the UMS package products.
Ref. : DSCHE1260QAG0200 - 19 Jul 10
11/14
Specifications subject to change without notice
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UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
