CHA6664-QDG
12-16GHz High Power Amplifier
Unit : mm
(For production, design must be adapted with regard to PCB tolerances and
assembly process)
Basic footprint for a 24L-QFN4x4
(Please, refer to the UMS proposed footprint for optimum
operation in the following “Proposed Assembly board” section)
The RF ports are DC blocked on chip. The DC connection (Vd) does not include any
decoupling capacitor in package, therefore it is mandatory to provide a good external DC
decoupling on the PC board, as close as possible to the package.
SMD mounting procedure
The SMD leadless package has been designed for high volume surface mount PCB
assembly process. The dimensions and footprint required for the PCB (motherboard) are
given in the drawings above.
For the mounting process standard techniques involving solder paste and a suitable reflow
process can be used. For further details, see application note AN0017.
Ref.: DSCHA6664QDG6332 - 28 Nov 06
8/10
/Specifications subject to change without notice
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UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
