CHA5042
13-16GHz High Power Amplifier
MMIC Outline & Bond Pads
Not to scale, dimensions are in millimeters
2
1
1.33
±0.35
3
4
5
8
(0, 0)
7
6
1.37
±0.35
Bond Pad
1
2
3
4
5
6
7
8
Symbol
RF input
Vd1
Vd2
Vd3
RF output
Vg3
Vg2
Vg1
x-dim.
y-dim.
x-center
y-center
(um)
100
100
100
100
100
100
100
100
(um)
200
100
90
100
200
100
100
100
(um)
100
285
450
1120
1285
1280
895
505
(um)
820
1230
1230
1235
790
155
105
105
Chip size : 1370µm +/-35µm x 1330µm +/- 35µm
Ref. : DSCHA50422218 -06-Aug.-02
4/6
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09