X Band Driver Amplifier
Bonding recommendations
Port
IN
(1)
OUT
(12)
Connection
CHA5012
Inductance (Lbonding) = 0.3nH
400µm length with wire diameter of 25 µm
Inductance (Lbonding) = 0.3nH
400µm length with wire diameter of 25 µm
Assembly recommendations in test fixture using TTL interface
Note: when the TTL interface is used for biasing, the pin TO (pin number 4) must be
connected to the pins Vctrl ( pins number 5 and 8).
Assembly recommendations in test fixture using analog biasing
circuits
Ref. : DSCHA50120179 - 28 Jun 10
9/10
Specifications subject to change without notice
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UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
