CHA4693-QGG
17-27GHz Variable Gain Amplifier
Recommended footprint for 28L-QFN5X5
Unit: mm
SMD mounting procedure
The SMD leadless package has been designed for high volume surface mount PCB
assembly process. The dimensions and footprint required for the PCB (motherboard) are
given in the drawing above.
For the mounting process standard techniques involving solder paste and a suitable reflow
process can be used. For further details, see application note AN0017.
Ref. : DSCHA4693-QGG8144 - 23 May 08
15/16
Specifications subject to change without notice
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