CHA4105-99F
2-4GHz Driver
Bonding recommendations
The RF, DC and modulation port inter-connections should be done according to the following
table:
Port
Connection
Inductance (Lbonding) = 0.3nH
400µm length with wire diameter of 25 µm x2
IN (pad 1)
Inductance (Lbonding) = 0.3nH
400µm length with wire diameter of 25 µm x2
OUT (pad 5)
DC pads to 1st decoupling level for
single bonding
Inductance (Lbonding) =0.8nH
one wire: diameter 25µm, length 1mm
1st decoupling level to 2nd
Inductance (Lbonding) =0.8nH
decoupling level for single bonding
one wire: diameter 25µm, length 1mm
DC Schematic
Driver : 5V, 180mA
V+
30
150 mA
1100
6000
0.6 mA
28 mA
2.7 mA
RF_in
RF_out
1015
4000
6310
9000
V-
Ref. : DSCH41051035 - 07 Feb11
10/12
Specifications subject to change without notice
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UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
