31-40GHz Variable Gain Amplifier
1 625
CHA3694
1 975
2 080
540
360
625
445
1
05
1
20
1 690
1 840
2 290
000
000
2 41
0
Bonding pad positions
( Chip thickness : 70µm. All dimensions are in micrometers )
Notes
- Due to ESD protection circuits on RF input and output, an external capacitance might be
requested to isolate the product from external voltage that could be present on the RF
accesses.
Vd
RFin
RFout
…
Vg
Vctrl
ESD protections are also implemented on gate and control accesses.
-
Due to BCB coating on the chip, qualification domain implies the chip must be glued.
Ref. : DSCHA3694-8155 - 03 Jun 08
11/12
Specifications subject to change without notice
Route Départementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
