7-20GHz Amplifier
Recommended footprint for 24L QFN4X4
CHA3667aQDG
Unit :mm
Via hole ø0.3
0.7
0.23
Taper
0.7
0.2
0.37
0.42
Q PIN
FN
SMD mounting procedure
The SMD Leadess package has been designed for high volume surface mount PCB
assembly process. The dimensions and footprint required for the PCB ( motherboard) are
given in the drawing above.
For the mounting process standard techniques, involving solder paste and a suitable reflow
process can be used. For further details, see application note AN0017.
Ref: DSCHA3667aQDG7296 - 23 Oct 07
11/14
Specifications subject to change without notice
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Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
0.45
UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
