CHA3396-QDG
27-33.5GHz Medium Power Amplifier
Package outline (1)
Matte tin, Lead Free
Units :
(Green)
1- NC
9- VG2
10- VG3
11- NC
17- Gnd(2)
18- NC
mm
2- Gnd(2)
3- Gnd(2)
4- RF IN
5- Gnd(2)
6- Gnd(2)
7- NC
From the standard :
JEDEC MO-220
(VGGD)
19- NC
12- NC
20- Gnd(2)
21- VD3
22- VD2
23- VD1
24- NC
25- GND
13- Gnd(2)
14- Gnd(2)
15- RF OUT
16- Gnd(2)
8- VG1
(1) The package outline drawing included to this data-sheet is given for indication. Refer to the
application note AN0017 (http://www.ums-gaas.com) for exact package dimensions.
(2) It is strongly recommended to ground all pins marked “Gnd” through the PCB board.
Ensure that the PCB board is designed to provide the best possible ground to the package.
Ref. : DSCHA3396-QDG5260 -17 Sep 15
12/16
Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34
UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
