18-30GHz Low Noise Amplifier
CHA2693-QAG
contact over the whole pad areas. Voids or other improper connections, in particular, between the
ground pads of motherboard and package will lead to a deterioration of the RF performance and
the heat dissipation. The latter effect can reduce drastically reliability and lifetime of the product.
(For production, design must be adapted with regard to PCB tolerances and assembly
process)
Basic footprint for a 16L-QFN3x3 (all units mm)
(Please, refer to the UMS propose footprint for optimum
operation in the following “Proposed Assembly board” section)
The RF ports are DC blocked on chip. The DC connection (Vd) does not include any decoupling
capacitor in package, therefore it is mandatory to provide a good external DC decoupling on the
PC board, as close as possible to the package.
SMD mounting procedure
The SMD leadless package has been designed for high volume surface mount PCB assembly
process. The dimensions and footprint required for the PCB (motherboard) are given in the
drawings above.
For the mounting process standard techniques involving solder paste and a suitable reflow process
can be used. For further details, see application note AN0017.
Ref. : DSCHA2693QAG6332 - 28 Nov 06
9/12
Specifications subject to change without notice
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UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
