CHA2266
Chip Assembly and Mechanical Data
Drain supply feed
100 pF
12.5-17GHz Driver Amplifier
VD 1
IN
VD 2
OUT
Notes: Vd1 & Vd2 pads are internally connected
Supply feed should be bypassed. 25µm diameter gold wire is recommended
Bond pad positions and Pin references
(Chip thickness : 100 µm. all dimensions are in micrometers)
Dimensions : 2320 x 1020µm
±
35µm
Ordering Information:
CHA2266-99F/00
Information furnished is believed to be accurate and reliable. However
United Monolithic Semiconductors
S.A.S.
assumes no responsibility for the consequences of use of such information nor for any infringement of
patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of
United Monolithic Semiconductors S.A.S..
Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied.
United Monolithic Semiconductors S.A.S.
products are not authorised for use
as critical components in life support devices or systems without express written approval from
United Monolithic
Semiconductors S.A.S.
Ref. : DSCHA22667082- 23 Mar 07
8/8
Specifications subject to change without notice
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Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
