Preliminary
BAS85
Pb
RoHS
COMPLIANCE
200mW Hermetically Sealed Glass Fast
Switching Schottky Barrier Diodes
MINI MELF
Features
Low forward voltage drop
LL-34( Mini-MELF) package
Through-Hole device type mounting
Hermetically sealed glass
Compression bonded construction
All external surfaces are corrosion
resistant and terminals are readily
solderable
RoHS compliant
Solder Hot Dip Tin (Sn) lead finish
Dimensions in inches and (millimeters)
Maximum Ratings and Electrical Characteristics
Rating at 25
o
C ambient temperature unless otherwise specified.
Maximum Ratings
Type Number
Power Dissipation
Repetitive Peak Reverse Voltage
Maximum DC Blocking Voltage
Average Forward Rectified Current
Peak Forward Surge Current
Operating Junction Temperature
Storage Temperature Range
Symbol
Pd
V
RRM
V
R
I
F(AV)
I
FSM
Value
200
30
30
200
4
125
-65 to + 125
Units
mW
V
V
mA
A
O
C
O
C
T
J
T
STG
Symbol
B
V
I
R
V
F
Min
30
Electrical Characteristics
Type Number
I
R
=10uA
V
R
=25V
IF=0.1mA
IF=1.0mA
IF= 10mA
IF=30mA
IF =100mA
Reverse Recovery Time (Note 1)
Junction Capacitance V
R
=1V, f=1.0MHz
Breakdown Voltage
Reverse Leakage Current
Forward Voltage
Typ
Max
2
0.24
0.32
0.40
0.50
0.80
Units
V
uA
V
5
Trr
10
Cj
Notes: 1. Reverse Recovery Test Conditions: I
F
= I
R
=10mA, R
L
=100Ω, I
RR
=1mA
nS
pF
Version: A08
TSC [ TAIWAN SEMICONDUCTOR COMPANY, LTD ]
