TGC4402-SM
Table IV
Power Dissipation and Thermal Properties
Parameter
Test Conditions
Value
Notes
Maximum Power Dissipation
Tbaseplate = 70 ºC
Pd = 0.45 W
1/ 2/
Tchannel = 138 ºC
Tm = 1.0E+6 Hrs
Thermal Resistance, θjc
LO input power is 17 dBm
30 seconds
θjc = 76 (ºC/W)
Tchannel = 121 ºC
Tm = >1E+6 Hrs
Mounting Temperature
Storage Temperature
320 ºC Max
-65 to 150 ºC
1/
2/
For a median life, Tm, of 1E+6 hours, power dissipation is limited to
Pd(max) = (TBD ºC – Tbase ºC)/θjc.
Channel operating temperature will directly affect the device median time to failure (MTTF). For
maximum life, it is recommended that channel temperatures be maintained at the lowest possible
levels.
3
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April 2012 © Rev A
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