TGC4402-SM
Assembly Notes
Recommended Surface Mount Package Assembly
• Proper ESD precautions must be followed while handling packages.
• Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
• TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow
oven vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles
are listed in the table below.
• Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot
placement. The volume of solder paste depends on PCB and component layout and should be well
controlled to ensure consistent mechanical and electrical performance.
• Clean the assembly with alcohol.
Typical Solder Reflow Profiles
Reflow Profile
Ramp-up Rate
SnPb
3 °C/sec
Pb Free
3 °C/sec
Activation Time and Temperature
Time above Melting Point
Max Peak Temperature
Time within 5 °C of Peak Temperature
Ramp-down Rate
60 – 120 sec @ 140 – 160 °C
60 – 150 sec
60 – 180 sec @ 150 – 200 °C
60 – 150 sec
240 °C
260 °C
10 – 20 sec
10 – 20 sec
4 – 6 °C/sec
4 – 6 °C/sec
Ordering Information
Part
Package Style
TGC4402-SM
QFN 4x4 Surface Mount
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
April 2012 © Rev A
TRIQUINT [ TRIQUINT SEMICONDUCTOR ]
