Mechanical Drawing
Units: Millimeters
TGA4823-2-SM
TGA4823-2
YYWW ZZZ
DXXXXXXX
Part Markings:
YY = Assembly year, WW= Assembly week, ZZZ = Serial Number, DXXXXXXX = Batch ID
Pad finish on package base:
Materials:
Electroless gold (Au)
Over
0.5 – 1.0 um
Package base
Package lid
Aluminum Nitride (AlN)
White Alumina (Al203)
Electroless nickel (Ni) 2.0 um min.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
May 2012 © Rev C