RFAM3620
®
Evaluation Board Assembly Drawing
Note:
The ground plane of the RFAM3620 module should be soldered onto a board equipped with as many thermal vias as possible. Underneath
this thermal via array a heat sink with thermal grease needs to be placed which is able to dissipate the complete module DC power. In any
case the module backside temperature should not exceed 100°C
Evaluation Board Schematic
FB1
Bead 60Ω
V+
C3
4.7nF
D3
R1
2.7kΩ
PTVS13VS1UR
D2
MM3Z5V6T1
Power
Enable
C8
4.7nF
21
20
19
18
17
16
Att.
Adjust
1
2
15
14
Power
enable
V1 +
V2 +
C15
C17
C9
4.7nF
C13
DNI
DNI
0.3pF
Att. Adjust
C4
4.7nF
GND
T1
RFXF0006
T2
RFXF0008
T3
RFXF0009
2
3
4
5
2
1
13
12
11
3
4
U1
RFAM3620
RF In+
RF In-
RF Out+
2
1
3
4
3
4
C2
4.7nF
C5
4.7nF
C6
4.7nF
DC Out
RF Out-
1
RF OUTPUT
RF INPUT
C10
DNI
C1
DNI
D1
C16
DNI
TQP200002
25V
D4
C7
DNI
C11
DNI
C18
0.3pF
TQP200002
25V
bac k
side
5
6
7
8
9
10
R2
3.3kΩ
Vt
C12
4.7nF
C14
DNI
Data Sheet Rev.F, June 7, 2017 | Subject to change without notice
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