CATV 75 Ω pHEMT Dual RF Amplifier
PCB Mounting Pattern
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation.
We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.010”).
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
Data Sheet –Rev (B), July 5, 2017 | Subject to change without notice
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TRIQUINT [ TRIQUINT SEMICONDUCTOR ]
