QPA3503
3 W, 28 V, 3.4 – 3.6 GHz GaN PA Module
QPA3503 3.4 – 3.6 GHz Reference Design
EVB Layout
EVB Schematic
PCB Stackup and Material
Notes:
1. All dimensions are in inches.
2. PCB is soldered on a 2 inch by 2 inch copper base plate with 0.25 inch thickness.
Bill of Materials – QPA3503 3.5 GHz Evaluation Board
Reference Des. Value Description
Manuf. Part No.
Panasonic EEEFK1H221P
C1, C10
C4, C7, C14
C3, C8, C11, C13
C2, C9, C12
J1, J2
220 µF Capacitor, 220 µF, electrolytic 50 V
22,000 pF Capacitor, 22,000 pF, 10%, 50 V, X7R, 0603
4.7 µF Capacitor, 4.7 µF, 10%, 50 V, X7R, 1206
Murata
Murata
Murata
GRM188R71H223KA01D
GRM31CR71H475KA12L
GRM32ER71H106KA
10 µF
Capacitor, 10 µF, 10%, 50 V, X7R, 1210
Connector, SMA, 4-Hole Panel Mount Jack
Gigalane PAF-S00-000
P1, P2
Connector, HDR, ST, PLRZD, 5-Pin, 0.100” ITW Pancon MPSS100-5-C
P3
Connector, HDR, ST, 3-PIN, T/H
3W 3.5GHz PA Module
Molex
Qorvo
22-28-4033
QPA3503
U1
- 4 of 12 -
Rev. A
www.qorvo.com
TRIQUINT [ TRIQUINT SEMICONDUCTOR ]
