BB0502X7R104M16VNT9820 参数 Datasheet PDF下载

Advance Product Datasheet

TGA4953EPU

THERMAL INFORMATION

Parameter

Test Condition

P

diss

(W)

.71

T

Base

(°C)

80

T

CH

(°C)

98

R

θJC

(°C/W)

26

MTTF

(HRS)

>1E6

R

θ

JC

Thermal Resistance

(channel to backside of

carrier)

Vd2T=4.7V,

Id2T=150mA +/-5%

Notes:

1. Based on a detailed thermal model of the output stage where channel temperature is highest.

Assumes worst case power dissipation condition (where no RF is applied at the input (no

power is dissipated in the load).

2. Thermal transfer is conducted thru the bottom of the TGA4953EPU package into the motherboard.

Design the motherboard to assure adequate thermal transfer to the base plate.

Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process

specifications. Specifications are subject to change without notice.

3

TriQuint Semiconductor Texas : (972)994 8465

Fax (972)994 8504 Web: www.triquint.com