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AH420 参数 Datasheet PDF下载

AH420图片预览
型号: AH420
PDF下载: 下载PDF文件 查看货源
内容描述: 4W高线性度的InGaP HBT放大器 [4W High Linearity InGaP HBT Amplifier]
分类和应用: 放大器
文件页数/大小: 8 页 / 558 K
品牌: TRIQUINT [ TRIQUINT SEMICONDUCTOR ]
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AH420
4W High Linearity InGaP HBT Amplifier
Mechanical Information
This package is lead-free/green/RoHS-compliant. The plating material on the backside metallization is Matte Tin. It is compatible with both
lead-free (maximum 260
°C
reflow temperature) and lead (maximum 245
°C
reflow temperature) soldering processes.
Outline Drawing
Product Marking
The AH420 will be marked with an “AH420G”
designator with a lot code marked below the
part designator. The “Y” represents the last
digit of the year the part was manufactured, the
“XXX” is an auto-generated number, and “Z”
refers to a wafer number in a lot batch.
AH420G
YXXX-Z
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
Mounting Configuration / Land Pattern
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes 250V to <500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class IV
Passes
1000V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260
°C
convection reflow
Standard:
JEDEC Standard J-STD-020
Functional Pin Layout
Notes:
1. A heatsink underneath the area of the PCB for the mounted device is recommended for proper thermal
operation. Damage to the device can occur without the use of one.
2. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80
/ .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”).
3. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal
performance.
4. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and construction.
7. Use 1 oz. Copper minimum.
8. All dimensions are in millimeters
Pin
1
2, 11
3, 4, 5, 6
7, 8, 9, 10
12
Function
VBIAS
No Connect
RF Input
VCC / RF Output
IREF
Specifications and information are subject to change without notice
TriQuint Semiconductor Inc
Phone 1-503-615-9000
FAX: 503-615-8900
e-mail: info-sales@tqs.com
Web site: www.TriQuint.com
Page 8 of 8 Aug 2009