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AH322-S8PCB2140 参数 Datasheet PDF下载

AH322-S8PCB2140图片预览
型号: AH322-S8PCB2140
PDF下载: 下载PDF文件 查看货源
内容描述: 2W高线性度的InGaP HBT放大器 [2W High Linearity InGaP HBT Amplifier]
分类和应用: 放大器
文件页数/大小: 8 页 / 446 K
品牌: TRIQUINT [ TRIQUINT SEMICONDUCTOR ]
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AH322
2W High Linearity InGaP HBT Amplifier
Mechanical Information
This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260
°C
reflow temperature) and lead (maximum 245
°C
reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an
“AH322G” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes
250V to < 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class III
Passes
1000V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260
°C
convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Configuration / Land Pattern
Functional Diagram
1
8
2
3
7
6
4
5
Mounting Config. Notes
1. A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the
device can occur without the use of one.
2. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill
and have a final plated thru diameter of .25 mm (.010”).
3. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
4. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contact the
heatsink.
5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and construction.
7. Use 1 oz. Copper minimum.
8. All dimensions are in millimeters (inches). Angles are in degrees.
Function
Iref
Input
Output / Vcc
Vbias
GND
GND
Pin No.
8
3
6, 7
1
Backside Paddle
2, 4, 5
.
TriQuint Semiconductor, Inc
Phone 1-800-951-4401
FAX: 408-577-6633
e-mail: info-sales@tqs.com
Web site: www.TriQuint.com
April 2009