TQP7M9102
½W High Linearity Amplifier
Pin Configuration and Description
GND
4
1
2
3
RF IN
GND
RF OUT
Pin
Symbol
Description
RF Input. Requires external match for optimal performance. External DC Block
required.
1
RF IN
2, 4
3
GND
RF/DC Ground Connection
RF Output. Requires external match for optimal performance. External DC Block
and supply voltage is required.
RFout / Vcc
Applications Information
PC Board Layout
PCB Material (stackup):
1071363AW REV - 1071363PC REV -
+VCC
1 oz. Cu top layer
0.014 inch Nelco N-4000-13, εr=3.7
1 oz. Cu MIDDLE layer 1
Core Nelco N-4000-13
GND
1 oz. Cu middle layer 2
0.014 inch Nelco N-4000-13
1 oz. Cu bottom layer
Finished board thickness is 0.062±.006
50 ohm line dimensions: width = .031”, spacing = .035”.
The pad pattern shown has been developed and tested for
optimized assembly at TriQuint Semiconductor. The PCB
land pattern has been developed to accommodate lead and
package tolerances. Since surface mount processes vary
from supplier to supplier, careful process development is
recommended.
SOT89 EVAL. BRD., 1/2 WATT
Data Sheet: Rev D 10/04/11
Disclaimer: Subject to change without notice
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