TMC6200 DATASHEET (Rev. 1.01 / 2018-NOV-15)
42
Parameter
total thickness
stand off
mold thickness
lead width (plating)
lead width
lead frame thickness
(plating)
Ref
A
A1
A2
b
b1
c
Min
Nom
Max
1.2
0.15
1.05
0.27
0.23
0.2
-
-
-
1
0.22
0.2
-
0.05
0.95
0.17
0.17
0.09
lead frame thickness
body size X (over pins)
body size Y (over pins)
body size X
body size Y
lead pitch
c1
D
E
D1
E1
e
L
L1
1
2
3
R1
R2
S
0.09
-
9.0
9.0
7.0
7.0
0.5
0.6
1 REF
3.5°
-
12°
12°
-
-
-
0.16
lead
footprint
0.45
0.75
0°
0°
7°
-
13°
13°
-
11°
11°
0.08
0.08
0.2
4.9
4.9
0.2
-
exposed die pad size X
exposed die pad size Y
package edge tolerance
lead edge tolerance
coplanarity
M
N
5
5
5.1
5.1
0.2
0.2
0.08
0.08
0.05
aaa
bbb
ccc
ddd
eee
lead offset
mold flatness
13.2 Package Codes
Type
Package
Temperature range
Code & marking
TMC6200-TA
TMC6200-TA-T
TQFP-EP48 (RoHS)
-40°C ... +125°C
TMC6200-TA
Tape on reel packed products
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