TMC262 DATASHEET (Rev. 2.07 / 2013-FEB-14)
55
19 Package Mechanical Data
19.1 Dimensional Drawings
Attention: Drawings not to scale.
Figure 19.1 Dimensional drawings
Parameter
Ref
Min
Nom
Max
Total thickness
Standoff
Mold thickness
Lead frame thickness
Lead width
A
0.80
0.00
-
0.85
0.035
0.65
0.203
0.25
5.0
0.90
0.05
0.67
A1
A2
A3
b
D
E
0.2
0.3
Body size X
Body size Y
5.0
Lead pitch
e
0.5
Exposed die pad size X
Exposed die pad size Y
Lead length
J
K
L
3.2
3.2
0.35
3.3
3.3
0.4
3.4
3.4
0.45
0.1
Package edge tolerance aaa
Mold flatness
Coplanarity
Lead offset
bbb
ccc
ddd
eee
0.1
0.08
0.1
Exposed pad offset
0.1
19.2 Package Code
Device
Package
Temperature range Code/ Marking
-40° to +125°C TMC262-LA
TMC262
QFN32 (RoHS)
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