TC1606
REV5_20070502
SMALL SIGNAL MODEL, VDS = 8 V, IDS = 500 mA
SCHEMATI
PARAMETERS
0.0196 nH
0.225 Ohm
8.87 pF
0.197 Ohm
0.005 nH
1.073 pF
Lg
Rg
Cgs
Ri
Rs
Ls
Lg
Cgd
Ld
Rd
Rg
Cgs
Ri
Gm
Cds
Cds
Rds
Rd
Ld
Rds
0.455 Ohm
0.361 pF
880.6 mS
3.9 psec
31.85 Ohm
0.315 Ohm
0.004 nH
T
Cgd
Gm
T
Rs
Ls
CHIP HANDLING
DIE ATTACHMENT: Conductive epoxy or eutectic die attach is recommended. Eutectic die attach can be
accomplished with Au-Sn (80%Au-20%Sn) perform at stage temperature: 290°C ± 5°C; Handling Tool: Tweezers;
Time: less than 1min.
WIRE BONDING: The recommended wire bond method is thermocompression bonding with 0.7 to 1.0 mil
(0.018 to 0.025 mm) gold wire. Stage temperature: 220°C to 250°C; Bond Tip Temperature: 150°C; Bond Force:
20 to 30 gms depending on size of wire and Bond Tip Temperature.
HANDLING PRECAUTIONS: The user must operate in a clean, dry environment. Care should be exercised
during handling avoid damage to the devices. Electrostatic Discharge (ESD) precautions should be observed at all
stages of storage, handling, assembly, and testing. The static discharge must be less than 300V.
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
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Fax: 886-6-5051602
TRANSCOM [ TRANSCOM, INC. ]
