TC1401N
REV5_20070502
SMALL SIGNAL MODEL, V
DS
= 8 V, I
DS
= 120 mA
SCHEMATI
Lg
Rg
Cgs
Ri
T
Cgd
Gm
Cds
Rds
Rd
Ld
PARAMETERS
Lg
Rg
Cgs
Ri
Cgd
Rs
0.071 nH
1.27 Ohm
2.36 pF
2.01 Ohm
0.069 pF
253 mS
3.9 psec
Rs
Ls
Cds
Rds
Rd
Ld
1.68 Ohm
0.013 nH
0.297 pF
103.7 Ohm
1.75 Ohm
0.013 nH
Gm
T
Ls
LARGE SIGNAL MODEL, V
DS
= 8 V, I
DS
= 120 mA
SCHEMATI
Lg
Rg
Cgs
Id
Ris
Cds
Cbs
Rs
Cgd
Rid
Rdb
Rd
Ld
TOM2 MODEL PARAMETERS
VTO
ALPHA
BETA
GAMMA
DELTA
Q
NG
ND
TAU
RG
RD
RS
IS
N
VBI
VDELTA
-1.812
14.13
0.354
0.0228
0.1565
0.88
0.1
0.01
3.9
1.2733
1.32
1.675
1E-11
1
1
0.2
VMAX
CGD
CGS
CDS
RIS
RID
VBR
RDB
ps
CBS
Ohm
TNOM
Ohm
LS
Ohm
LG
mA
LD
AFAC
V
NFING
V
V
0.5
0.0691
3.9867
0.278
2.005
0.0001
15
119.667
4.7433
25
0.0131
0.0715
0.013
1
1
V
pF
pF
pF
Ohm
Ohm
V
Ohm
pF
°C
nH
nH
nH
Ls
CHIP HANDLING
DIE ATTACHMENT:
Conductive epoxy or eutectic die attach is recommended. Eutectic die attach can be
accomplished with Au-Sn (80%Au-20%Sn) perform at stage temperature: 290°C
±
5°C; Handling Tool: Tweezers;
Time: less than 1min.
WIRE BONDING:
The recommended wire bond method is thermocompression bonding with 0.7 to 1.0 mil
(0.018 to 0.025 mm) gold wire. Stage temperature: 220°C to 250°C; Bond Tip Temperature: 150°C; Bond Force:
20 to 30 gms depending on size of wire and Bond Tip Temperature.
HANDLING PRECAUTIONS:
The user must operate in a clean, dry environment. Care should be exercised
during handling avoid damage to the devices. Electrostatic Discharge (ESD) precautions should be observed at all
stages of storage, handling, assembly, and testing. The static discharge must be less than 300V.
TRANSCOM, INC.,
90 Dasoong 7
th
Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site:
www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
5/5
TRANSCOM [ TRANSCOM, INC. ]
