TC1304
REV5_20070502
SCHEMATIC
TOM2 MODEL PARAMETERS
Parameters
Parameters
0.5 V
-0.393 V
VTO
ALPHA
BETA
GAMMA
DELTA
Q
NG
ND
TAU
RG
RD
VMAX
6.47
0.4622
0.0394
0.3935
0.78
0.0754 pF
6.18 pF
CGD
CGS
CDS
RIS
Lg
Rg
Cgd
Ld
Rd
Rid
Id
0.1313 pF
2.2 Ohm
0.001 Ohm
9 V
Cgs
Ris
Rdb
Cbs
RID
0.1
VBR
RDB
CBS
TNOM
LS
LG
LD
Cds
0.01
120 Ohm
0.042 pF
4.255 ps
℃
25
1.2 Ohm
Rs
Ls
1.29 Ohm
1.594 Ohm
1E-11 mA
1
0.01 nH
0.041 nH
0.04 nH
1
RS
IS
N
VBI
AFAC
NFING
1 V
1
0.2 V
VDELTA
CHIP HANDLING
DIE ATTACHMENT: Conductive epoxy or eutectic die attach is recommended. For eutectic die attach can be
accomplished with Au-Sn (80%Au-20%Sn) perform in State Temperature: 290℃ ± 5℃ ; Handling Tool :
Tweezers ; Time: less than 1min .
WIRE BONDING: The recommended wire bond method is thermo-compression bonding with 0.7 or 1.0 mil
(0.018 or 0.025mm) gold wire. Stage Temperature: 220°C to 250°C ; Bond Tip Temperature : 150℃ ; Bond Force:
20 to 30 gms depending on size of wire and Bond Tip Temperature.
HANDLING PRECAUTIONS: The user must operate in a clean, dry environment. Care should be exercised
during handling avoid damage to the devices. Electrostatic Discharge (ESD) precautions should be observed at all
stages of storage, handling, assembly, and testing. The static discharge must be less than 300V.
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
6 / 6
Fax: 886-6-5051602
TRANSCOM [ TRANSCOM, INC. ]
