TC1201
REV5_20070502
CHIP DIMENSIONS
430± 12
D
D
250± 12
S
G
S
G
S
Units: Micrometers
Chip Thickness: 100
Gate Pad: 55 x 50
Drain Pad: 55 x 50
Source Pad: 55 x 65
TYPICAL SCATTERING PARAMETERS
6
.
0
4.
0
2.0
2
.
0
4
.
0
6
.
0
8 0
. .
0 1
0
.
2
8
.
0
0
.
1
0
.
2
(T
A
=25
°
C)
V
DS
= 4 V, I
DS
= 25 mA
Mag Max
0.15
1
2
0
13
5
15
0
15
165
0
-180
-15
-165
0
9
1
0
5
5
7
0
6
Swp Max
18GHz
0
3.
0
4. 0
5.
10.0
0
.
0
1
0.01-
Swp Max
18 GHz
45
30
S11
0
0 00
. ..
3 45
2
-0.
.4
-0
6
.
0
-
8
.
0
-
0
.
1
-
0.
0. 5-
4-
0.
3-
0
.
2
-
S12
50
-1
35
-1
0
2
1
-
-
6
0
-4
5
5
0
1
-
-
9
0
-
7
5
-3
0
Swp Min
2GHz
0.075
Per Div
Swp Min
2 GHz
TRANSCOM, INC.,
90 Dasoong 7
th
Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site:
www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
2/6
TRANSCOM [ TRANSCOM, INC. ]
