TSM9634
PACKAGE OUTLINE DRAWING
5-Pin SOT23 Package Outline Drawing
(N.B., Drawings are not to scale)
NOTES:
1. Dimensions and tolerances are as per ANSI Y14.5M, 1982.
2. Package surface to be matte finish VDI 11~13.
5
2.80 - 3.00
3. Die is facing up mold and facing down for trim/form,
ie, reverse trim/form.
0.950
0.95
TYP
TYP
4. The foot length measuring is based on the gauge plane method.
55.. Dimensions are exclusive of mold flash and gate burr.
6. Dimensions are exclusive of solder plating.
7. All dimensions are in mm.
8. This part is compliant with EIAJ spec. and JEDEC MO-178 AA
0.30 - 0.50
9. Lead span/stand off height/coplanarity are considered as special
characteristic.
1.90 Max
10º TYP
1.50 – 1.75
10º TYP
0.09 – 1.45
0.60 – 0.80
0.90 - 1.30
0º- 8º
0.25
0.00 - 0.15
0.09 - 0.20
5
0.30 - 0.55
Gauge Plane
10º TYP
10º TYP
0.10 Max
0.50 – 0.70
0.50 Max
0.30 Min
0.20 Max
0.09 Min
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assume any responsibility for its use nor for any infringements of patents or other rights of third parties that may result from its use, and all
information provided by Touchstone Semiconductor and its suppliers is provided on an AS IS basis, WITHOUT WARRANTY OF ANY KIND.
Touchstone Semiconductor reserves the right to change product specifications and product descriptions at any time without any advance
notice. No license is granted by implication or otherwise under any patent or patent rights of Touchstone Semiconductor. Touchstone
Semiconductor assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using Touchstone Semiconductor components. To minimize the risk associated with customer products and applications,
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respective owners.
Touchstone Semiconductor, Inc.
Page 11
630 Alder Drive, Milpitas, CA 95035
+1 (408) 215 - 1220 ▪ www.touchstonesemi.com
TSM9634DS r1p0
RTFDS
TOUCHSTONE [ TOUCHSTONE SEMICONDUCTOR INC ]
