TS6001
ELECTRICAL CHARACTERISTICS
VIN = +5V, IOUT = 0, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C. See Note 1.
PARAMETER
OUTPUT
SYMBOL
CONDITIONS
MIN
TYP
2.500
2.500
MAX
UNITS
2.498
-0.08
2.496
-0.16
2.502
0.08
2.504
0.16
7
10
10
15
V
%
V
TS6001A
TS6001B
TS6001A
TS6001B
Output Voltage
VOUT
TA = +25°C
%
0°C ≤ TA ≤ +85°C
-40°C ≤ TA ≤ +85°C
0°C ≤ TA ≤ +85°C
-40°C ≤ TA ≤ +85°C
2
2.5
3
Output Voltage Temperature
Coefficient (See Note 2)
TCVOUT
ppm/°C
ppm/V
4
(ΔVOUT/VOUT
/ΔVIN
(ΔVOUT/VOUT
/ΔIOUT
)
)
Line Regulation
(VOUT + 0.2V) ≤ VIN ≤ 12.6V
10
30
Sourcing
Sinking
0 ≤ IOUT ≤ 500μA
-500μA ≤ IOUT ≤ 0
30
70
240
320
Load Regulation
ppm/mA
mV
Dropout Voltage (See Note 3)
OUT Short-Circuit Current
VIN -VOUT
IOUT = 500μA
75
150
VOUT Short to GND
VOUT Short to IN
4
4
ISC
mA
Temperature Hysteresis
(See Note 4)
Long-Term Stability
(See Note 5)
100
75
ppm
ppm/
168hr
ΔVOUT/ time 168hr at TA = +25°C
DYNAMIC
f = 0.1Hz to 10Hz
eOUT
50
75
μVP-P
μVRMS
Noise Voltage
f = 10Hz to 10kHz
Ripple Rejection
ΔVOUT/ ΔVIN VIN = 5V ±100mV, f = 120Hz
82
dB
Turn-On Settling Time
Capacitive-Load Stability
Range
tR
To VOUT = 0.1% of final value, COUT = 50 pF
340
μs
COUT
See Note 6
0
2200
pF
INPUT
Supply Voltage Range
Quiescent Supply Current
Change in Supply Current
VIN
IIN
IIN/VIN
Guaranteed by line-regulation test
VOUT + 0.2
12.6
35
0.2
V
μA
μA/V
31
0.1
(VOUT + 0.2V) ≤ VIN ≤ 12.6V
Note 1: All devices are 100% production tested at TA = +25°C and are guaranteed by characterization for TA = TMIN to TMAX, as specified.
Note 2: Temperature Coefficient is measured by the “box” method; i.e., the maximum ΔVOUT is divided by the maximum ΔT.
Note 3: Dropout voltage is the minimum input voltage at which VOUT changes ≤0.2% from VOUT at VIN = 5.0V.
Note 4: Temperature hysteresis is defined as the change in the +25°C output voltage before and after cycling the device from +25°C to TMIN to
+25°C and from +25°C to TMAX to +25°C.
Note 5: Reference long-term drift or stability listed in the table is an intermediate result of a 1000-hour evaluation. Soldered onto a printed
circuit board (pcb), voltage references exhibit more drift early in the evaluation because of assembly-induced differential stresses
between the package and the pcb.
Note 6: Not production tested; guaranteed by design.
TS6001DS r1p0
Page 3
RTFDS