TS6001
PACKAGE OUTLINE DRAWING
3-Pin SOT23 Package Outline Drawing
(N.B., Drawings are not to scale)
0.5Max
0.3Min
2
0.50 Max
0.30 Min
2.64 Max
2.10 Min
0.20 Max
0.16 Max
0.08 Min
0.08 Min
0.45 Max
0.30 Min
1.03 Max
0.89Min
2.05 Max
1.78 Min
3.04 Max
2.80 Min
1.40 Max
1.20 Min
0.54 Max
0.48 Min
1
0.20 Max
0.08Min
10' TYP
GAUGE
PLANE
0.94 Max
0.88 Min
0.25
0' – 8'
10' TYP
0.10 Max
0.41 Max
0.21 Min
0.685 Max
0.406 Min
NOTE:
Does not include mode flash, protrusions or gate burns.
Mode flash, protrusions or gate burns shall not exceed
0.127 mm per side
1
Does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 0.127 mm per side.
2
Die is facing up for mold die and trim-form.
3.
4.
Lead span/stand of high/coplanarity are considered as special characteristic.
5.
6.
All specifications referd JEDEC TO-236AB except for lead length dimension.
Controlling dimension in (mm)
Information furnished by Touchstone Semiconductor is believed to be accurate and reliable. However, Touchstone Semiconductor does not
assume any responsibility for its use nor for any infringements of patents or other rights of third parties that may result from its use, and all
information provided by Touchstone Semiconductor and its suppliers is provided on an AS IS basis, WITHOUT WARRANTY OF ANY KIND.
Touchstone Semiconductor reserves the right to change product specifications and product descriptions at any time without any advance
notice. No license is granted by implication or otherwise under any patent or patent rights of Touchstone Semiconductor. Touchstone
Semiconductor assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using Touchstone Semiconductor components. To minimize the risk associated with customer products and applications,
customers should provide adequate design and operating safeguards. Trademarks and registered trademarks are the property of their
respective owners.
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TS6001DS r1p0
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