TS3006
PACKAGE OUTLINE DRAWING
8-Pin TDFN33 Package Outline Drawing
(N.B., Drawings are not to scale)
0.80 Max
0.70 Min
0.25 Ref
1.85 Max
1.65 Min
3.05 Max
2.95 Min
1.60 Max
1.40 Min
PIN 1
MARKING
0.5 Max
0.3 Min
0.05 Max
0.00 min
0.35 Ref
3.05 Max
2.95 Min
0.65 ref
0.35 Max
0.25 Min
BOTTOM VIEW
TOP VIEW
0.80 Max
0.70 Min
0.05 Max
0.00 Min
0.05 Max
0.00 Min
0.20 REF
0.20 REF
DETAIL A
DETAIL A
SIDE VIEW
NOTE: CONTROLLING DIMENTIONS IN MILIMETERS
Compliant with JEDEC MO-229
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assume any responsibility for its use nor for any infringements of patents or other rights of third parties that may result from its use, and all
information provided by Touchstone Semiconductor and its suppliers is provided on an AS IS basis, WITHOUT WARRANTY OF ANY KIND.
Touchstone Semiconductor reserves the right to change product specifications and product descriptions at any time without any advance
notice. No license is granted by implication or otherwise under any patent or patent rights of Touchstone Semiconductor. Touchstone
Semiconductor assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using Touchstone Semiconductor components. To minimize the risk associated with customer products and applications,
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respective owners.
Touchstone Semiconductor, Inc.
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TS3006DS r1p0
RTFDS
TOUCHSTONE [ TOUCHSTONE SEMICONDUCTOR INC ]
