TS3003
PACKAGE OUTLINE DRAWING
10-Pin TDFN33 Package Outline Drawing
(N.B., Drawings are not to scale)
3.00±0.05
Dap Size
2.65X1.90 mm
0.25±0.05
CO.35
2.30±0.10
Pin 1 DOT BY
MARKING
3.00±0.05
0.50 BSC
1.60±0.10
0.40±0.05
0.30Ref
TOP VIEW
BOTTOM VIEW
NOTE!
All dimensions in mm.
Compliant with JEDEC MO-229
0.75±0.05
0.00±0.05
SIDE VIEW
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assume any responsibility for its use nor for any infringements of patents or other rights of third parties that may result from its use, and all
information provided by Touchstone Semiconductor and its suppliers is provided on an AS IS basis, WITHOUT WARRANTY OF ANY KIND.
Touchstone Semiconductor reserves the right to change product specifications and product descriptions at any time without any advance
notice. No license is granted by implication or otherwise under any patent or patent rights of Touchstone Semiconductor. Touchstone
Semiconductor assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using Touchstone Semiconductor components. To minimize the risk associated with customer products and applications,
customers should provide adequate design and operating safeguards. Trademarks and registered trademarks are the property of their
respective owners.
Touchstone Semiconductor, Inc.
Page 10
630 Alder Drive, Milpitas, CA 95035
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TS3003DS r1p0
RTFDS
TOUCHSTONE [ TOUCHSTONE SEMICONDUCTOR INC ]
