TS1101
PACKAGE OUTLINE DRAWING
6-Pin SOT23 Package Outline Drawing
(N.B., Drawings are not to scale)
Note:
Dimension are exclusive of mold flash and gate burr.
2. Dimension are exclusive of solder plating.
2.80 - 3.00
3. The foot length measuring is based on the gauge plane method.
4. Package is surface to be matte finish VDI 11~13.
5. Dimensions and tolerances are as per ANSI Y14.5M, 1982.
6. This part is compliant with EIAJ specification SC74A and JEDEC MO-178 AB spec.
7. Die is facing up for mold, Die is facing down for trim/form, ie. reverse trim/form.
8. All dimensions are in mm.
0.950
TYP.
0.950
TYP.
0.300(MIN)
0.500(MAX)
10° TYP.
(2 Plcs)
10° TYP.
(2 Plcs)
1.50 – 1.75
0.60 - 0.80
0.50 -0.70
0.09 – 0.127
0.25
0° ~ 8°
Guage
Plane
0.30 - 0.55
10° TYP.
(2 Plcs)
10° TYP.
(2 Plcs)
0.050(MIN)
0.15(MAX)
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assume any responsibility for its use nor for any infringements of patents or other rights of third parties that may result from its use, and all
information provided by Touchstone Semiconductor and its suppliers is provided on an AS IS basis, WITHOUT WARRANTY OF ANY KIND.
Touchstone Semiconductor reserves the right to change product specifications and product descriptions at any time without any advance
notice. No license is granted by implication or otherwise under any patent or patent rights of Touchstone Semiconductor. Touchstone
Semiconductor assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using Touchstone Semiconductor components. To minimize the risk associated with customer products and applications,
customers should provide adequate design and operating safeguards. Trademarks and registered trademarks are the property of their
respective owners.
Touchstone Semiconductor, Inc.
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TS1101DS r1p0
RTFDS
TOUCHSTONE [ TOUCHSTONE SEMICONDUCTOR INC ]
