TS1003
PACKAGE OUTLINE DRAWING
5-Pin SC70 Package Outline Drawing
(N.B., Drawings are not to scale)
0.65 TYP.
2
0.15 - 0.30
5
1
4
3
1.80 - 2.40
2
1.30 TYP.
1.80 - 2.20
8º - 12º ALL
SIDE
1
0.800 – 0.925
0.40 – 0.55
LEAD FRAME THICKNESS
0.10 - 0.18
0.15
TYP.
1.00
MAX
GAUGE PLANE
1.15 - 1.35
0º - 8º
0.00 - 0.10
0.10 MAX
0.26 - 0.46
0.275 - 0.575
NOTES:
1
DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
DOES NOT INCLUDE INTER-LEAD FLASH OR PROTRUSIONS.
2
3. DIE IS FACING UP FOR MOLDING. DIE IS FACING DOWN FOR TRIM/FORM.
4
ALL SPECIFICATION COMPLY TO JEDEC SPEC MO-203 AA
5. CONTROLLING DIMENSIONS IN MILIMITERS.
6. ALL SPECIFICATIONS REFER TO JEDEC MO-203 AA
7. LEAD SPAN/STAND OFF HEIGHT/COPLANARITY ARE CONSIDERED AS SPECIAL CHARACTERISTIC
Information furnished by Touchstone Semiconductor is believed to be accurate and reliable. However, Touchstone Semiconductor does not
assume any responsibility for its use nor for any infringements of patents or other rights of third parties that may result from its use, and all
information provided by Touchstone Semiconductor and its suppliers is provided on an AS IS basis, WITHOUT WARRANTY OF ANY KIND.
Touchstone Semiconductor reserves the right to change product specifications and product descriptions at any time without any advance
notice. No license is granted by implication or otherwise under any patent or patent rights of Touchstone Semiconductor. Touchstone
Semiconductor assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using Touchstone Semiconductor components. To minimize the risk associated with customer products and applications,
customers should provide adequate design and operating safeguards. Trademarks and registered trademarks are the property of their
respective owners.
Touchstone Semiconductor, Inc.
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TS1003DS r1p0
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