Part Numbering Nomenclature
Example 1
TMP 89 F S 60 x x UG
Package
QG: Plastic shrink quad outline non-leaded package (VQON); dry-packed
XBG: Plastic ball grid array (BGA); dry-packed
WBG: Wafer level chip size package (WCSP), dry-packed
UG, DUG, FG, DFG: Plastic quad flat package (QFP); dry-packed
MG, DMG: Plastic small-outline package (SOP); dry-packed
NG: Plastic shrink dual in-line package (SDIP)
PG: Plastic standard dual in-line package (DIP)
Automotive quality grade
R: Grade A, −40°C to +85°C
T: Grade A, −40°C to +125°C
I: Grade B, −40°C to +85°C
S: Grade B, −40°C to +125°C
Microcontroller revision
Microcontroller subtype
ROM size
1
1
2
2
3
3
4
4
6
6
8
8
C
H
KB
12 16
K
M
N
P
S
U
W
F
Y
Z
D
KB 24 32 40 48 60/64 96 128 192 256 384 512
ROM type
C: Mask
E: EEPROM
F: Flash
P: OTP
Microcontroller core
47: 47E
86: 870/C
87: 870
89:
91:
870/C1
900/L1
95: 900/H
96: 900
92, 94: 900/H1
93: 900/L
88: 870/X
Toshiba microcontrollers
Example 2
TMP 19A 23 F Y x XBG
Package
XBG: Plastic ball grid array (BGA); dry-packed
UG, FG: Plastic quad flat package (QFP); dry-packed
Part designator / Microcontroller revision
ROM size
H
M
R
S
W
Y
Z
D
E
10 1D 20
KB 16
32
56
64 128 256 384 512 768 1024 1536 2048
ROM type
C: Mask
F: Flash
Microcontroller subtype
Microcontroller core
19
M3: 03
19A: 19A, 19A/H1
A9: 09
Toshiba microcontrollers
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TOSHIBA [ TOSHIBA ]
