CRG03
i
– v
P
– I
F (AV) F (AV)
F
F
10
1.4
1.2
Pulse test
Halfsine waveform
T = 150°C
j
1.0
0.8
0.6
0°
180°
Conduction angle 180°
75°C
1
25°C
0.4
0.2
0.0
0.1
0.4
0.8
1.2
1.6
2.0
2.4
2.8
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Average forward current
I
(A)
F (AV)
Instantaneous forward voltage vF
(V)
Ta max – I
F (AV)
160
140
120
100
80
Device mounted on Device mounted on
a ceramic board
a glass-epoxy board
□
□
Soldering land
Board size
2 mm
6 mm
Device mounted on a
ceramic board
□
□
50 mm
50 mm
Board thickness
1.6 t
0.64 t
Device mounted on a
glass-epoxy board
60
Halfsine waveform
40
20
0°
180°
Conduction angle 180°
0
0
0.2
0.4
0.6
0.8
1.0
1.2
Average forward current
I
(A)
F (AV)
Surge forward current
(non-repetitive)
r
– t
th (j-a)
30
25
20
15
10
5
10000
Ta = 25°C
f = 50 Hz
(1) Device mounted on a ceramic board:
Soldering land: 2 mm × 2 mm
(2) Device mounted on a glass-epoxy board:
Soldering land: 6 mm × 6 mm
1000
100
10
(2)
(1)
1
0
1
10
100
0.001
0.01
0.1
1
10
100
Number of cycles
Time
t
(s)
2006-11-06
3
TOSHIBA [ TOSHIBA ]
