XC6415
Series
■PACKAGING INFORMATION (Continued)
●
USP-6 Power Dissipation
Power dissipation data for the USP-6C is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient:
Natural convection
Soldering: Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm2 in one side)
Cupper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the cupper traces
Glass Epoxy (FR-4)
Material:
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Operating temperature
Board Mount (Tj max = 125℃)
Ambient Temperature（℃）
Power Dissipation Pd（mW）
Heat Resistance (℃/W)
100
25
85
1000
400
Pd vs. Ta
1200
1000
800
600
400
200
0
25
45
65
85
105
125
Ambient Temperature Ta（℃）
19/20
TOREX [ Torex Semiconductor ]
