XC6371/6372/6373 Series
■PIN CONFIGURATION
*The dissipation pad for the USP-6B
package should be solder-plated in
recommended mount pattern and metal
masking so as to enhance mounting
strength and heat release. If the pad needs
to be connected to other pins, it should be
connected to the pin No.1.
■PIN ASSIGNMENT
XC6371/72/73A
PIN NUMBER
PIN NAME
FUNCTION
SOT-89
USP-6B
1
2
3
－
6
1
4
VSS
VOUT
Lx
Ground
Output Voltage Monitor/IC Internal Power Supply
Switch
2, 3, 5
NC
No Connection
XC6371/72/73C
PIN NUMBER
PIN NAME
FUNCTION
SOT-89-5
USP-6B
5
2
4
3
1
6
1
4
3
2, 5
VSS
VOUT
Lx
CE
NC
Ground
Output Voltage Monitor/IC Internal Power Supply
Switch
Chip Enable
No Connection
XC6371/72/73E
PIN NUMBER
PIN NAME
FUNCTION
SOT-89-5
USP-6B
5
2
4
3
1
6
1
4
3
2, 5
VSS
VDD
Lx
VOUT
NC
Ground
IC Internal Power Supply
Switch
Output Voltage Monitor
No Connection
582
TOREX [ Torex Semiconductor ]
