XC6216/XE6216
Series
■PACKAGING INFORMATION (Continued)
●
SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition:
Ambient:
Soldering:
Board:
Mount on a board
Natural convection
Lead (Pb) free
Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used.)
Glass Epoxy (FR-4)
Material:
Thickness:
Through-hole:
1.6 mm
4 x 0.8 Diameter
評価基板レイアウト(単位:mm)
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Operating temperature
Board Mount (Tj max = 125℃)
Ambient Temperature(℃)
Power Dissipation Pd(mW) Thermal Resistance (℃/W)
25
85
600
240
166.67
Pd-Ta特性グラフ
Pd vs. Ta
700
600
500
400
300
200
100
0
25
45
65
85
105
125
Ambient Temperature Ta (℃)
周辺温度Ta(℃)
37/41