XC6216/XE6216 Series
■PACKAGING INFORMATION (Continued)
●
SOT-89-5 Power Dissipation
Power dissipation data for the SOT-89-5 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition:
Ambient:
Soldering:
Board:
Mount on a board
て
Natural convection
Lead (Pb) free
Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Glass Epoxy (FR-4)
Material:
Thickness:
Through-hole:
1.6 mm
5 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Operating temperature
Board Mount (Tj max = 125℃)
Ambient Temperature（℃）
Power Dissipation Pd（mW） Thermal Resistance (℃/W)
25
85
1300
76.92
520
Pd-Ta特性グラフ
Pd vs. Ta
1400
1200
1000
800
600
400
200
0
25
45
65
85
105
125
Ambient Temperature Ta (℃)
周辺温度Ta（℃）
38/41
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