XC2164
Series
●
SOT-26 Power Dissipation
Power dissipation data for the SOT-26 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
40.0
28.9
1. Measurement Condition (Reference data)
Condition:Mount on a board
Ambient:Natural convection
Soldering:Lead (Pb) free
Board:Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material:Glass Epoxy (FR-4)
Thickness:1.6 mm
1.4
2.54
Through-hole:4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125℃)
Ambient Temperature（℃）
Power Dissipation Pd（mW）
Thermal Resistance(℃/W)
25
85
600
240
166.67
Pd vs Ta
700
600
500
400
300
200
100
0
25
45
65
85
105
125
Ambient Temperature Ta（℃）
19/20
TOREX [ Torex Semiconductor ]
