XC2164 Series
■PAD DIMENSIONS
■PAD LAYOUT FOR CHIP FORM
PAD DIMENSIONS
PIN
NAME
PIN NUMBER
X
Y
1
2
3
4
5
6
Q0
VSS
/ XT
XT
514
222
- 450
- 450
514
47
- 264
- 264
- 264
264
27
VDD
/ INH
1.3×0.8mm
XC2164xx1xxT : 280±20μm
XC2164xx1xxF : 200±20μm
264
unit [μm]
V
DD Level
100×100μm
■PRODUCT CLASSIFICATION
●Ordering Information
XC2164 ①②③④⑤⑥
DESIGNATOR
DESCRIPTION
SYMBOL
DESCRIPTION
A
: Chip Enable: f0/1
B
C
D
K
: Chip Enable: f0/2 (Fundamental only)
: Chip Enable: f0/4 (Fundamental only)
: Chip Enable: f0/8 (Fundamental only)
: Output Enable: f0/1
Divider Ratio
&
/INH Pin Function
①
L
M
N
: Output Enable: f0/2 (Fundamental only)
: Output Enable: f0/4 (Fundamental only)
: Output Enable: f0/8 (Fundamental only)
5
6
1
: Not polyimide coating on the chip surface (SOT-26 only)
: Polyimide coating on the chip surface (Chip form only)
: CMOS (VDD/2) *TTL: Fundamental 4MHz to 30MHz
: 3rd Overtone, built-in type
②
③
④
Chip Surface Treatment
Duty Level
(Table 1)
(Table 2)
Frequency Range & Rf,
Cg, Cd Values
: Fundamental, built-in type
C
M
R
L
T
F
: Chip form
: SOT-26
: Embossed tape, standard feed
: Embossed tape, reverse feed
: Chip tray (Wafer thickness : 280±20μm)
: Chip tray (Wafer thickness : 200±20μm)
⑤
⑥
Packages
Device Orientation
Table 1: 3rd Overtone, Built-In Type
FREQUENCY RANGE
Rf
Cg
Cd
SYMBOL
(kΩ)
(pF)
(pF)
3.3V ±10%
5.0V ±10%
20MHz to 30MHz
30MHz to 40MHz
40MHz to 50MHz
50MHz to 65MHz
65MHz to 80MHz
80MHz to 95MHz
95MHz to 110MHz
110MHz to 125MHz
－
A
B
C
D
E
F
H
K
L
－
9.0
6.5
5.0
3.5
2.8
2.5
2.2
2.0
2.3
21.5
20.0
16.0
14.0
12.5
10.0
8.0
21.5
20.0
16.0
14.0
12.5
10.0
8.0
20MHz to 30MHz
30MHz to 40MHz
40MHz to 50MHz
50MHz to 65MHz
65MHz to 80MHz
80MHz to 95MHz
95MHz to 110MHz
110MHz to 125MHz
7.0
5.5
7.0
5.5
Table 2: Fundamental, Built-In Type
FREQUENCY RANGE
Rf
（kΩ）
Cg
（pF）
Cd
（pF）
SYMBOL
3.3V ±10%
5.0V ±10%
M, V
T
4MHz to 30MHz
4MHz to 30MHz
4MHz to 30MHz
4MHz to 30MHz
3.5/7.0
3.5/7.0
20.0
35.0
20.0
35.0
(*)Rf = 3.5MΩ@VDD = 5.0V Operation
Rf = 7.0 MΩ@VDD =3.3V Operation
2/12
TOREX [ Torex Semiconductor ]
