XBP06V1E4MR-G
■PACKAGING
INFORMATION
●
SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1.
Measurement Condition (Reference data)
Condition:
Ambient:
Soldering:
Board:
Mount on a board
Natural convection
Lead (Pb) free
Dimensions 40 x 40 mm (1600 mm in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used.)
Material:
Thickness:
Glass Epoxy (FR-4)
1.6 mm
2
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
評価基板レイアウト（単½：mm）
2. Power Dissipation vs. Operating temperature
Board Mount (Tj max = 150℃)
Ambient Temperature（℃）
25
105
Power Dissipation Pd（mW）
750
270
Thermal Resistance (℃/W)
166.67
Pd vs. Ta
Pd-Ta特性グラフ
Power Dissipation: Pd (mW)
800
700
600
500
400
300
200
100
0
25
50
75
100
125
周囲温度Ta（℃）
Ambient Temperature: Ta (℃)
150
許容損失Pd（mW）
3/4
TOREX [ TOREX SEMICONDUCTOR ]
