XB1117 Series
■ABSOLUTE MAXIMUM RATINGS
XB1117P501
PARAMETER
SYMBOL
VIN
RATINGS
10.0
UNITS
V
Input Voltage
Thermal Resistance
θJC
θJA
PD
15
(Junction to Case)
℃/W
mW
℃
Thermal Resistance
160
625
(Junction to Ambient)
Power Dissipation
(ΔT=100℃)
Operating Temperature Range
Operating Junction Temperature Range
Storage Temperature Range
Lead Temperature
Topr
Tj
0 ~+70
0 ~+125
- 65 ~+150
260
Tstg
Tlead
*Stress above the listed absolute maximum rating may cause permanent damage to the device.
** The rated values of the XB1117P18 / 25 / 30 (VOUT=1.8V, 2.5V and 3.0V) and XB1117K type are different from that
of the XB1117P50 (VOUT=5.0V).
■ELECTRICAL CHARACTERISTICS
XB1117P501
Ta=25℃
PARAMETER
Output Voltage
Line Regulation
Load Regulation
SYMBOL
VOUT
CONDITIONS
MIN.
TYP.
MAX. UNITS
VIN=7.0V
4.950
4.900
5.000
5.000
5.050
V
IOUT=0A
*Over Temp.
*Over Temp.
5.100
7.0V≦VIN≦9.0V
IOUT=0A
ΔVOUT1
ΔVOUT2
-
1
6
mV
VIN=7.0V
-
5.0
10.1
1.2
15.2
0A≦IOUT≦1.0A
ΔVOUT=±1%
0A≦IOUT≦1.0A
*Over Temp.
-
-
20.2
1.4
V
Dropout Voltage
Current Limit
Vdif
ILIM
ISS
*Over Temp.
*Over Temp.
-
1.3
-
7.0V≦VIN≦10.0V
VIN=7.0V
1.0
1.5
-
A
Supply Current
*Over Temp.
-
-
-
6
13
mA
0A≦IOUT≦1.0A
7.0V≦VIN≦10.0V
0A≦IOUT≦1.0A
VIN=7.0V
Temperature
Coefficient
TC
TS
50
0.5
-
-
ppm/℃
Temperature Stability
*Over Temp.
%
IOUT=100mA
*Over Temp. = Over Temperature(0~+70℃)
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