TRMB Chip Multilayer Bead Inductors
TOKEN
Environmental Characteristics
Item
Specification
Test Methods
Flexure Strength The forces applied on
the right conditions must
Test device shall be soldered on the substrate Substrate
Dimension:100×40×1.6mm
20
not damage the terminal
Deflection: 2.0mm
1.6
electrode and the ferrite
Keeping Time: 30sec
For 0402, substrate dimension
2
45
45
is 100×40×0.8mm
Vibration
Test device shall be soldered on the substrate
Oscillation Frequency : 10 to 55 to 10Hz for 1min Amplitude :
1.5mm
Time : 2hrs for each axis (X,Y&Z), total 6hrs
Resistance to
Soldering
Heat
Appearance: No damage
More than 75% of the
terminal electrode should be Immersion Time: 10 ± 1sec
covered with solder.
Pre-heating: 150°C, 1min
Solder Temperature: 260 ± 5°C
Impedance: within± 30%
of initial value
Solderability
The electrodes shall be
at least 90% covered
with new solder coating
Pre-heating: 150°C, 1min
Solder Temperature: 245 ± 5°C
Immersion Time: 4 ± 1sec
Terminal
Strength
Test
0402 series : ≥0.2kg
0603 series : ≥0.5kg
0805 series : ≥1.0kg
other series : ≥ 2.0kg
Test device
shall be soldered
on the substrate
W
Temperature
Cycle
Appearance: No damage
Impedance: within ± 30%
of initial value
One cycle:
One cycle/step1: -55 ± 3°C for 30mi
step2: 25 ± 2°C for 3.0min
step3:125 ± 3°C for 30min
step4:25 ± 2°C for 3.0min
Total: 100cycles
Measured after exposure in the room condition for 24hrs
Humidity
Temperature: 40 ± 2°C
Resistance
Relative Humidity: 90 ~ 95% time: 1000hrs
Measured after exposure in the room condition for 24hrs
High
Temperature: 125 ± 3°C
Temperature
Resistance
Relative Humidity : 0%
Applied Current: Rated Current time: 1000hrs
Measured after exposure in the room condition for 24hrs
Low
Temperature: -55 ± 3°C
Temperature
Resistance
TR elative Humidity : 0% time: 1000hrs
Measured after exposure in the room condition for 24hrs
03 of 17
Version 2010
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