Effective Date Feb. 2005
G32 Series
Recommended Land Patterns
Flow Soldering Method
G32A
1.8
Soldering Guidelines
Unit: mm
G32B
1.8
1.6
2.3
#2
1.0
1.0
5.7
#2
1.0
6.6
R 1.4
2.1
2.3
1.2
0.8
3.2
1.2
1.2
0.8
3.2
1.2
#3
#1
1.0
R 1.4
#3
#1
Reflow Soldering Method
G32A
1.6
G32B
1.6
1.5
2.2
#2
0.9
4.6
#3
#1
1.0
1.2
#3
#1
#2
0.9
6.0
1.0
1.9
1.2
0.8
3.2
1.2
0.8
3.2
1.2
1.2
Recommended Soldering Profiles
Flow Soldering Profile
Reflow Soldering Profile
TP 260°C Max. Peak Temp.
250
Temperature (°C)
200
150
100
50
TM 230°C Solder Melting Temp.
Temperature (°C)
250
TP 260°C Max. Peak Temp.
TM 230°C Solder Melting Temp.
(190°C)
(170°C)
Pre-Heat Zone
2 min.
ts.
*
40 sec.
Solder
Melting Time
1
2
Time (min.)
3
4
(180°C)
(140°C)
ts.
*
5 sec.
Solder
Melting Time
200
150
100
50
1
2
Time (min.)
3
4
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AMERICA, INC.
1177 East Tower Road, Schaumburg, IL 60173
Tel: 847-884-6664
Fax: 847-884-6665
E-mail: sales@tocos.com
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