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tmCH
T6330A
Thermal Considerations
Thermal protection limits power dissipation in T6330A. When the operating junction temperature
exceeds 165°C, the OTP circuit starts the thermal shutdown function and turns the pass element off.
The pass element turns on again after the junction temperature cools by 30°C. For continuous
operation, do not exceed absolute maximum operatiog junction temperature 125°C. The power
dissipation definition in device is shown as following formula :
PD = (VIN - VOUT) x IOUT + VIN x IQ
The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the
rate of surroundings airflow and temperature difference between junction to ambient. The
maximum power dissipation can be calculated by following formula :
PD(MAX) = ( TJ(MAX) - TA ) / θJA
Where TJ(MAX) is the maximum operating junction temperature 125°C, TA is the ambient
temperature and the θJA is the junction to ambient thermal resistance. For recommended operating
conditions specification of T6330A, where TJ(MAX) is the maximum junction temperature of the die
(125°C) and TA is the maximum ambient temperature.
TM Technology Inc. reserves the right
P. 5
Publication Date: JAN. 2008
Revision: A
to change products or specifications without notice.
TMT [ TAIWAN MEMORY TECHNOLOGY ]
