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XTR115UA/2K5 参数 Datasheet PDF下载

XTR115UA/2K5图片预览
型号: XTR115UA/2K5
PDF下载: 下载PDF文件 查看货源
内容描述: 4-20mA电流环变送器 [4-20mA CURRENT LOOP TRANSMITTERS]
分类和应用: 模拟IC信号电路
文件页数/大小: 13 页 / 259 K
品牌: TI [ TEXAS INSTRUMENTS ]
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PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Jan-2013  
Orderable Device  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
XTR116UAE4  
XTR116UG4  
ACTIVE  
SOIC  
SOIC  
D
8
8
75  
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
Level-3-260C-168 HR  
XTR  
116U  
A
ACTIVE  
D
Green (RoHS  
& no Sb/Br)  
Level-3-260C-168 HR  
XTR  
116U  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) Only one of markings shown within the brackets will appear on the physical device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2